Home > STMicroelectronics makes smart power technology available for prototyping through CMP

STMicroelectronics makes smart power technology available for prototyping through CMP

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Global semiconductors specialist STMicroelectronics Pty Ltd and CMP (Circuits Multi Projets) have made ST’s BCD8sP technology platform for smart-power ICs available for prototyping to universities, research labs, and design companies through the silicon brokerage services provided by CMP.

Considered the most advanced of ST’s Bipolar-CMOS-DMOS (BCD) technologies in production, the BCD8sP process enables the integration of analogue and logic circuitry with high-voltage power components to produce single-chip devices for complex power conversion and control applications. The process has enabled ST to surpass its competitors in important smart-power applications such as Hard Disk Drive (HDD) controllers, motor controllers, and power management ICs for smartphones, tablets, and computer servers among other equipment.

The availability of BCD design capability to third parties reflects the growing importance of state-of-the-art power integration in the drive for higher performance in computing, consumer, and industrial applications of the future.

According to Claudio Diazzi, Sense & Power and Automotive Sector, Front-End Manufacturing and Technology R&D, VP-Smart Power Technologies at STMicroelectronics, they look to CMP to help them identify and support innovative projects towards establishing long-term connections with talented designers and research organisations.

The introduction of ST’s BCD8sP process in CMP’s catalogue builds on the successful collaboration that has allowed universities and design firms to access leading-edge and previous bulk CMOS generations including 28nm, 65nm, and 130nm. CMP’s clients also have access to 28nm FD-SOI and 130nm SOI (Silicon-On-Insulator), as well as 130nm SiGe processes from STMicroelectronics.

Jean-Christophe Crebier, Director of CMP explains that with ST’s world-class BCD process in their portfolio, CMP can now provide even stronger support for advanced smart-power design projects. He adds that about 300 projects have been designed in ST’s 90nm process, more than 350 in bulk 65nm, and over 50 projects prototyped in 28nm FD-SOI.

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