Home > Toshiba launches low-height package transistor output photocoupler

Toshiba launches low-height package transistor output photocoupler

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Toshiba International announces the release of a new range of transistor output photocouplers in a low-height SO6L package, which can be used to replace conventional DIP4 pin package products.

The new Toshiba TLP385 features an isolation specification equivalent to DIP4 F (wide lead) type package products, and guarantees a creepage and clearance distance of 8mm (min), and isolation voltage of 5kVrms (min).

With a low height of 2.3mm (max), a 45% reduction from DIP4 type package products, the new TLP385 transistor output photocouplerscan be used in applications with strict height restrictions, such as on motherboards, and also contribute to the development of smaller sets.

The Toshiba TLP385 transistor output photocoupler is also suitable forapplications such as inverter interfaces and general-purpose power supplies.

Key specifications include Current Transfer Ratio 50 to 600% @ IF=5mA, VCE=5V; Turn-off Time (tOFF) 40μs (typ.) @ IF=16mA; Operating Temperature Range (Topr) -55°C to 110°C; Isolation Voltage (BVs) 5 kVrms; Safety Standard UL, cUL, VDE, CQC.

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