Product Showcase
Thermal Analysers for Plastics, Metals, Ceramics, Composites & Adhesives
Product/Service Name
Thermal analysis equipment and Thermogravimetric analysis TGA
Application/Function:
Our range of Thermal analysis equipment can be used for a variety of applications, such as plastics, metals, ceramics, composites and adhesives available from TSE. This includes the Netzsch range of thermal analysers, covering the common techniques of Differential Scanning Calorimetry DSC, and Thermogravimetric analysis TGA, but supported by an extensive range of other thermal analysis and thermal property measurement systems.
Thermal analysis is used to measure properties such as melting and solidification points, transition temperatures, and thermally induced reactions. The measurements may be quantitative to determine material composition or states. Extensive use is made of the differential scanning calorimetry DSC technique in determining the composition of plastics or composites mixtures and blends. Phase diagrams for metals can also be measured with greater precision and accuracy using DSC.
Thermogravimetric analysis TGA typically measures the decomposition with heating of materials in the presence of inert gas, reactive gases such as oxygen, or even vacuum in order to determine the proportions or stability of various components. Most Netzsch systems are vacuum tight, allowing the last traces of oxygen to be removed and achieve very pure atmospheres necessary for oxygen sensitive materials such as titanium and magnesium.
The process of curing in composites, paints and other coatings can be monitored using DSC, dynamic mechanical analysis DMA, and a new technique using Dielectric Analysis DEA to measure the mobility of dipoles to allow the monitoring of cure over the widest range of viscosity from liquid resin through to fully cured, including in mould monitoring. Curing under UV light is also possible for coatings and dental materials.
In addition measurements of thermal properties are often used to predict how substances will behave in a manufacturing process. Examples include measuring the thermal expansion coefficient of ceramics and glaze materials to avoid crazing, or the thermal conductivity of materials for use in furnaces and reactors. The laserflash method for thermal conductivity achieves a remarkable sensitivity and speed of measurement in a small sample size. Specific measurements of deflection under heating can be made with Thermomechanical analysis TMA, dynamic mechanical analysis DMA or refractoriness under load RUL.
Sometimes the methods are specified exactly in standards specified by bodies such as ASTM, DIN, ISO, AS/NZS, but often it is necessary to interpret the various standards to choose the most appropriate test method.
The Netzsch range of thermal analysis and thermal property measuring systems are also ideal for simultaneous measurement of DSC and TGA, or measurement of evolved gas from reactions using FTIR or mass spectrometry.
Differentiating Features:
- An experienced team of expertise in thermal analysis is supported by a PhD in Materials Engineering, and can advise on the best method for testing.
- Netzsch have an outstanding reputation for thermal analysis systems covering metals, plastics, ceramics, composites and adhesives.
- Simultaneous thermal analysis or evolved gas analysis.
All equipment is supported by more than 35 years of experience in Metallurgy, Plastics and Materials Engineering, to help you decide the right test and equipment.