EPSON, represented by TE Australia , has developed a new series of Bluetooth baseband ICs. The two ICs in the S1S11020F series feature built-in hands-free, headset, and mouse applications.
In addition to including protocol stacks such as Link Manager, L2CAP and RFCOMM, these ICs have built-in profiles needed for various applications. System developers will find these ICs make building a Bluetooth system easy.
The S1S11020F00A in particular is for hands-free communication systems in the promising automotive segment. Its integrated hands-free profile is based on CCAP Ver. 1.0, to maximise interoperability. Both types of IC in this series can be custom-configured with software required for a given application.
EPSON plans to develop a succession of Bluetooth v1.2-compliant Bluetooth ICs that support AFH, faster connection, and eSCO.