3M/ROBINSON Nugent has produced the RN PAK-50 interconnect system of 1.27mm connectors, available from Soanar .
Previously, the standard pitch for PC board connectors has been 2.54mm, but as systems become smaller and the corresponding mounting density of PC boards increases, it becomes necessary to increase the density and thus reduce the size of connectors.
The RN PAK-50 Interconnect System reduces the existing double mounting density.
The RN PAK-50 system uses redundant ribbon contacts to ensure reliability. Connector performance is not significantly changed after multiple insertions and with drawl cycles.
The RN PAK-50 achieves a 50% space saving compared to standard D-Subs.
The stacking height is between 7 and 30mm and the unit has 20-200 positions. It also features three dimensional mating and ejector locks for IDC that move inwards.
Available as options are: standard, through hole; high position count, through; low profile, through hole; low profile, SMT; power ground connectors; IDC; and low profile IDC.