The world’s largest semiconductor company, Intel, says it will begin eliminating around 95 percent of the lead used in its processors and chipsets starting later this year. In addition, National Semiconductor, IDT and Wolfson have announced their own “green” initiatives.
will begin shipping the lead-free technology with select microprocessors and chipsets in Q3, 2004, and embedded IA processors in Q2, 2004. The company shipped its first lead-free memory chips last year. The new packages use lead-free solder balls, which previously represented the majority of lead used in the companies chips. The remaining lead is forms part of the alloy used to connect the silicon die to the package itself. Intel says it is working with the industry to find a reliable alternative to this remaining “tiny amount of lead”.
The transition to lead-free represent a major industry challenge and although progress has been made, there is renewed emphasis because of impending European Union (EU) legislation in January 2006. For its part, Intel says it has been working with industry consortia and the EU’s Restriction of Hazardous Substances (RoHS) legislation committee to come up with a solution that can be used around the world. The company claims it has “developed reference procedures on [our] own research assembly lines to aid customers implement lead-free technology in their manufacturing process”.
Intel qualified its first lead-free Plastic Ball Grid Array package in 2001 for use with its Flash memory, and shipped its first lead-free product in 2002. The tin/lead (Sn/Pb) solder previously used for connecting this package to the motherboard was replaced with a tin/silver/copper (Sn/Au/Cu) alloy.
Taking the lead out
Among other companies’ initiatives, Wolfson, a UK-based chip maker, says it has successfully qualified the processes and materials for its emerging range of lead-free devices, and is now ready to begin shipping. “We are about to become an entirely lead-free supplier,” says Jim Reid, the firm’s CTO.
The company is replacing the traditional Sn/Pb component lead coating with a pure tin version. At 230 C, the melting temperature is higher than for traditional Sn/Pb alloys, but the company claims that PCB assemblers using Sn/Pb alloys do not need to make significant changes to assembly processes or the reflow profile. For PCB assemblers that have already changed to lead-free solder pastes, which require a higher solder paste melting temperature, the company’s-free packages have been qualified for a peak temperature of 260 C.
The company is also developing Pb-free BGA packages for forthcoming product introductions.
In a separate move, Japanese component vendor National Semiconductor (distributed by and ) says it plans to offer lead-free packages for its complete line of IC products by the end of 2004. The company will also “significantly” reduce bromine and antimony-based flame-retardants in an effort to make more “environmentally neutral” electronic components.
Again the lead is primarily used in the plating finish of copper leadframes and the solder balls of array. National will replace the lead in leadframe packages with a tin finish, and in the solder balls with a Sn/Au/Cu alloy. Once this program is fully implemented, National says it will eliminate five tonnes of lead per year.
Finally, IDT (distributed by Insight Electronics and Soanar ), a US chip vendor, is announcing that it has received a “green-partner” certificate from Sony Corporation for the development of environmentally sensitive products. Green partners must develop products that comply with Sony’s environmental standards. Japanese companies are regarded as leaders in the elimination of hazardous substances chiefly because of consumer pressures from the internal market.
The company completed the Sony green partner audit in April 2003 and received the official green-partner certificate in September 2003.
The company is working to employ the various phases of its plan, including the implementation of a lead-free plating process and lead-free solder balls. IDT says it will continue to support customers who require traditional products for the next several years.