Satcam presents a simple method of achieving ‘plated-through’ holes without investing in an electroplating system.
The through-hole connection system offers a simple manual process that allows quick and cost-effective conductivisation of circuit board holes.
Available in three sizes - 0.8mm, 1.0mm and 1.2mm - the system features a flat finish on both sides, making it SMT-friendly. Suitable for through-hole components with a hollow design, the through-hole connection system is made from pure copper for optimum conductivity.
Each kit contains tooling and sufficient bails for 250 holes. Additional packs of bail-bars are available.
The through-hole connection system applies a conductive coating to the walls of the circuit board hole while maintaining a flat surface on both sides of the circuit boards. After hand-setting, the holes are left with a solder-plated copper wall and a solder-filled barrel.
If a through-hole is not required, the top and bottom pads are simply soldered. Where a through-hole is necessary, the solder core is removed with a de-soldering tool or wick after soldering both sides. Either way, the holes are left with a tin-plated electrolytic-quality copper sleeve pressed into the hole walls, flat on both sides of the circuit board.