Samtec ANZ Information
Samtec ANZ News
Samtec launches new pitch interfaces (27-Sep-2006)
Samtec, represented in ANZ by Soanar, has expanded its Micro Card socket line with the introduction of surface mount 0,635mm (.025") pitch interfaces (MEC6 Series) available in both right-angle and vertical orientations.
New Micro Mate cable plugs introduced by Samtec (27-Sep-2006)
Samtec represented in ANZ by Soanar, Tiger Eye" contacts are used in new Micro Mate" discrete wire cable plugs (SFSD Series) to provide cable-to-board solutions for the popular TFM/SFM Series board-to-board interconnect system.
Samtec adds new Type B USB interface to product range (27-Sep-2006)
Samtec represented in ANZ by Soanar, has announced the addition of a high retention Type B USB interface (USBR Series) that complies with the class 1, Div II minimum withdrawal requirement of 15 Newtons.
High density interconnect arrays (2-Mar-2006)
SAMTEC’S new Searay high density interconnects (SEAM/SEAF Series) provide a solid grid of contacts on 1.27mm pitch and up to 500 I/Os. These connectors are the same footprint as the popular SamArray Series connector, but with added features and stack heights.
High density differential arrays (3-Feb-2006)
SAMTEC’S new Differential Pair Arrays (DPAM/DPAF Series) provide performance of up to a terabit per connector with up to 168 usable signal pairs. The signal pairs are on a staggered layout with perimeter grounds to reduce the overall number of grounds needed as well as simplify signal routing on the boards.
Expanded I/O interface product line (2-Feb-2006)
SAMTEC has added a large selection of modular jacks and D-subminiature connectors to its I/O interface product offering. These are in addition to its existing line D-subs, modular jacks, miniature DINs and high frequency serial interfaces.
Soanar appointed distributor for Samtec Interconnect products (19-Jan-2006)
Soanar has been appointed distributor of Samtec's complete Interconnect product range across Australia and New Zealand.
Signal Integrity Design Guide (18-Nov-2005)
SAMTEC'S ability to provide "Signal Integrity at Any Distance" is detailed in their new Interconnect Design and Signal Integrity Services Guide. It includes end-to-end solutions for panel-to-panel, panel-to-board, cable-to-board, and board-to-board applications.
Micro Tiger Eye contacts for rugged interface applications (2-Nov-2005)
SAMTEC’S Tiger Eye contacts are multi-finger, precision stamped and formed, Beryllium Copper contacts that are heat-treated to optimise spring properties for maximum cycles in high reliability applications. These contacts are available in .050" (1.27mm) pitch and .0787" (2mm) pitch connector sets and in IDC cable systems.
Large variety of one piece interfaces (19-Oct-2005)
SAMTEC’S One Piece Interfaces are ideal for high shock/vibration applications due to their robust design and treaded inserts to secure the connectors to the boards. They can provide a low system cost for board stacking by reducing the number of components required to be purchased and processed.
Automotive Interconnect Solutions Guide (30-Aug-2005)
SAMTEC has published a new Automotive Interconnect Solutions Guide to highlight their new products. The company’s automotive interconnect capabilities include rugged, power, cable plugs and receptacles, discrete wire systems, micro and standard board-to-board interconnects, Micro Card interfaces, I/O interfaces, RF connectors and cables and flex circuits.
Differential high speed flex data link (17-Aug-2005)
SAMTEC has introduced a new standard differential pair flex data link, the ZFHF series. This includes a .8mm (.0315") Q series socket or terminal on one end and a standard 43 pin .5mm (.0197") pitch ZIF flex termination on the other. These data links are easily modified for custom counts, cable lengths, guide posts, and terminations.
Micro pitch space flexibility (16-Aug-2005)
SAMTEC'S line of sub-millimeter micro pitch interfaces on .5mm (.197"), .635mm (.025"), and .8mm (.0315") pitch provide space and cost savings, along with the proven performance features of traditional blade and beam construction. These products are available with up to 300 and 240 I/Os.
D-subminiature cable assemblies (29-Jun-2005)
SAMTEC has added three cable termination options to its D-subminiature connector offering. For high-speed applications, the company offers 15 and 25-position plugs (DHSC series) with micro coax data rate cable.
Cables for RF connectors (27-Jun-2005)
SAMTEC has released RF cable connectors and cable assemblies to mate with its line of MMCX, MCX and SMA connectors. The SMA series of subminiature RF cable assemblies is available with straight and right-angle terminations.
Samtec expands I/O interface product line (27-May-2005)
SAMTEC has added modular jacks and high-speed/high-density interfaces to its I/O interface product line. The modular jacks include top-entry surface mount (MODS-H Series) and LED designs (MODS-F series) in both RJ45 and CAT5 configurations. A combination RJ45/USB jack (CRU series) is also available.
RF connector line (17-May-2005)
SAMTEC has released the MMCX, MCX, and SMA RF connectors. The MMCX series of micro-mini connectors is available as jacks and plugs and with a choice of through-hole, surface mount, and edge-mount terminations.
Standard and semi-custom power cable assemblies (9-May-2005)
MINIMATE (MMSD Series) with wire gauges from 20 to 30 AWG and PowerMate (IPBD Series) with wire gauges from 16 to 24 AWG are now available as standard cable assemblies from Samtec. MiniMate cable and connectors are rated at up to 6A at 20°C, while PowerMate cables and connectors are rated at up to 12A at 20°C.
High-speed flex circuit design services (5-Apr-2005)
SAMTEC’S in-house Signal Integrity Services division works with customers to design optimum conductor routing and termination to achieve the desired performance in high-speed flex circuit applications.
High-speed cable design guide (14-Mar-2005)
SAMTEC'S high-speed cable design guide covers data rate cable assemblies, RF cable assemblies, I/O cable assemblies, and high-speed flex circuit assemblies. It also discusses Samtec's signal integrity division.
Card-to-board interface for serial ATA (3-Mar-2005)
SAMTEC has released the SAL1 low-profile, high-speed, Micro Card socket interface. It provides a card-to-board interface for serial ATA and other high-speed daughtercard applications.
Samtec releases full line catalogue (19-Jan-2005)
SAMTEC has released the F-205 full line catalogue with 340 pages of applications, specifications, and ordering information for sudden circuits, high speed connectors, board-board interconnects, power systems, I/O interfaces and cable assemblies.
High-speed interconnect systems. (30-Nov-2004)
SAMTEC has released the Rise-Up RU8 series of high-speed interconnect systems. It uses two standard micro-card connectors and a matched impedance PCB with an embedded ground plane for improved performance over traditional connector sets for elevated board stacking.
Connector systems (21-Sep-2004)
SAMTEC has released the Micro Rugged Interfaces series of interconnect systems with friction locks, latches, keys, screw downs and guide-posts.
Signal integrity at any distance (1-Sep-2004)
SUDDEN Circuits, Samtec's program for providing ‘signal integrity at any distance’, is detailed in this new design guide. This includes capabilities for in-house design, analysis, and manufacturing of high speed connectors, circuits, and subsystems and integrated services.
High-speed connector options expanded (12-Aug-2004)
SAMTEC's Q2 second generation high speed connector system (QMSS/QFSS Series) options have been expanded with power pin options, positive alignment features, edge-mount designs, and single-ended and differential pair signal routing.
Cable assembly systems (6-Jul-2004)
SAMTEC'S expanded Data Rate high-speed cable assembly systems meet stringent signal integrity specifications on a variety of centrelines and configurations.
Full line catalogue (5-May-2004)
SAMTEC has the released the F-204 full line catalogue. The catalogue has over 360 pages of applications, specifications, and ordering information.
Interactive high speed cable builder (20-Apr-2004)
SAMTEC has released an interactive high speed cable assembly builder program at www.samtec.com that makes it as easy as a "click" to create valid Samtec high data rate cable part numbers. This program currently allows specification of high speed Q Strip assemblies on 0.5mm and 0.8mm pitch.
High density power interconnects (24-Mar-2004)
SAMTEC has introduced a high density power to board interconnect system on 2mm pitch (TPCM/TPCF series) that can be used for elevated board stacking.
New line of high speed I/O interfaces (18-Feb-2004)
SAMTEC has added a broad line of I/O interfaces to its high speed, micro pitch, cable, flex circuit, and application specific board-level interconnect products.
I/O interface catalogue and guide (12-Feb-2004)
SAMTEC has added I/O interfaces to its product line and published a new I/O interface guide. Included in the catalogue are an assortment of D sub-miniature, modular jacks, mini DINs and high speed serial I/O interconnects.
IBIS interconnect modelling specification (3-Feb-2004)
SAMTEC, represented by Arrow Electronics, has adopted the IBIS interconnect modeling specification (ICM Version 1.0) and joined the IBIS Open Forum as a member organisation.
High performance risk reduction (16-Jan-2004)
SAMTEC and Teraspeed signal integrity engineers have jointly developed a robust process that uses advanced 2D, 3D, frequency domain and time domain modeling, simulation, and measurement techniques that reduce risk in the development of high performance systems of 10Gbps and above.
High speed connectors for board mating (15-Jan-2004)
LOCKING screw options have been added to Samtec's .635mm pitch high speed interfaces (QTS-RA/QSS-RA Series) for mating boards in perpendicular and co-planar applications.
Automotive micro-rugged interface product line (21-Nov-2003)
SAMTEC automotive interface capabilities include high reliability, high cycle and high retention contacts and shrouded and keyed insulators with positive retention "align & latch" features for applications including board-to-board, power, cable, micro card and flex circuits.
High speed interconnect system (12-Nov-2003)
SAMTEC's new RISE-UP high speed interconnect system (HSC8 series) uses controlled impedance PCB with embedded ground plane for improved performance over traditional connector sets.
High speed cable systems (30-Oct-2003)
SAMTEC's new high speed cable assembly systems provide flexible high speed I/O solutions on 0.5mm (0.0197") and 0.8mm (0.0315") pitch (HQCD & EQCD Series), JTAG interfaces (HHSC Series), edge card interfaces (EEDP Series) and custom cable assemblies to meet any signal integrity specifications.
Optional locking cap for IDC systems (17-Oct-2003)
A NEW locking cap option for Samtec IDC systems on 1.27mm pitch (FFSD/FFMD Series) and 2mm pitch (TCSD/TCMD Series), has been added as a standard option for increased reliability and to prevent accidental unmating due to vibration or other causes.
High data rate cable assembly system (2-Oct-2003)
SAMTEC's new high data rate cable assembly system provides flexible high speed board-to-board solutions on 0.5mm HQCD Series) and 0.8mm (EQCD Series), JTAG interfaces (HHSC Series), edge card interfaces (EEDP Series), and custom cable assemblies, to meet most data rate and signal integrity requirements.
Samtec and Tyco form alliance (5-Aug-2003)
SAMTEC has announced the signing of a licensing agreement between Tyco Electronics and Samtec Inc. This agreement will establish Tyco Electronics as a second source supplier to Samtec's Q-Series by selling and/or manufacturing of these products.
Simplifying difficult board design issues (23-Jul-2003)
SAMTEC has simplified the use of high speed connectors by extending the concept of recommended PCB pad layouts and SPICE models beyond the connector and board interface. Samtec Final Inch reference designs address one of the most difficult design issues on the board.
Samtec introduces the Connector Wizard (1-Jul-2003)
THE Connector Wizard is a new on-line signal integrity resource from Samtec, represented by Arrow Electronics, for immediate access to expert technical support with design, search, communication and reference tools, for the development of high speed interconnects and flex circuitry systems.
High density interconnects solutions (11-Jun-2003)
SAMTEC, represented by Arrow Electronics, has announced that its SamArray high density interfaces have passed a 40-day mixed flowing gas testing which exceeds Telecordia standards which project a 20-year reliable life.
Samtec’s full line catalogue (20-May-2003)
SAMTEC has announced the release of its new Board Interface full line catalogue, F-203. This new catalogue has been expanded to include the company's Design Concept Guide that provides more than 320 pages of applications, specifications and ordering information.
Hermaphroditic connectors increase flexibility (16-Apr-2003)
SAMTEC now has three combination socket/terminal interface systems on 2.54mm, 2mm and 0.635mm pitch. These hermaphroditic connectors are self-mating, and therefore can reduce inventory costs by reducing the number of part numbers that must be stocked.
Micro IDC plug on 1.27mm pitch (28-Mar-2003)
SAMTEC has released its new double row micro IDC plug (FFMD Series) with terminals on 1.27mm x 1.27mm. Common lead counts from 5 to 25 positions per row are available with a 7 day delivery for quantities up to 100 assemblies.
Expanded micro card socket line (25-Feb-2003)
SAMTEC has expanded its 1mm pitch micro card socket line (MEC1 Series) with the addition of right angle and edgemount designs to its original vertical surface mount design. These sockets have a double row of beryllium copper contacts on 1mm pitch to provide the ultimate solution for many micro card interfaces.
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Samtec ANZ Products & Services