SAMTEC'S ability to provide "Signal Integrity at Any Distance" is detailed in their new Interconnect Design and Signal Integrity Services Guide.
It includes end-to-end solutions for panel-to-panel, panel-to-board, cable-to-board, and board-to-board applications as well as signal integrity design resources including Samtec’s unique Final Inch PCB design tools.
Samtec Signal Integrity interfaces include a wide variety of high speed/high density interconnect systems.
Single-ended and differential pair connectors, elevated board stackers, edge mount, right angle and card-edge systems for perpendicular and co-planar board mating, controlled impedance flex circuits, and high DataRate coax and twinax cable systems are available.
Signal Integrity services include a user-friendly web site for high speed connector SPICE, IBIS and 3D models, test reports, drawings, footprints and PADs layouts, application notes, white papers, and webinars.
Final Inch PCB design tools save design, development and validation time and resources.