Samtec ANZ

Samtec ANZ
5 Berrigan Court
Oakleigh South VIC 3167
Tel: 03 9512 7747
Fax: 03 9512 7745

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High performance risk reduction

SAMTEC and Teraspeed signal integrity engineers have jointly developed a robust process that uses advanced 2D, 3D, frequency domain and time domain modeling, simulation, and measurement techniques that reduce risk in the development of high performance systems of 10Gbps and above.

This process can be seen in Samtec's Final Inch signal integrity offering for the QStrip, Qpair, and SamArray connector families.

The importance of modeling that is appropriate to the system elements being modeled will be discussed, including how to combine these modeling elements into a hybrid unified time domain simulation environment using HSPICE.

The design of transparent measurement and validation boards will be described and stunning correlation shown between measured and simulated performance in the time and frequency domain for busses designed with standard high volume, low cost board-to-board connector systems.

S-parameter data from these test boards will be shown to match solutions generated from electromagnetic field solvers and simulation. In addition, time domain measurements will show near-exact correlation between simulation and measurement.

Finally, real eye pattern measurements of an operating 10Gbps board-to-board system will be demonstrated to show the power of this hybrid methodology in characterising and optimising design performance.

Samtec ANZ News

Samtec launches new pitch interfaces (27-Sep-2006)
Samtec, represented in ANZ by Soanar, has expanded its Micro Card socket line with the introduction of surface mount 0,635mm (.025") pitch interfaces (MEC6 Series) available in both right-angle and vertical orientations.

New Micro Mate cable plugs introduced by Samtec (27-Sep-2006)
Samtec represented in ANZ by Soanar, Tiger Eye" contacts are used in new Micro Mate" discrete wire cable plugs (SFSD Series) to provide cable-to-board solutions for the popular TFM/SFM Series board-to-board interconnect system.

Samtec adds new Type B USB interface to product range (27-Sep-2006)
Samtec represented in ANZ by Soanar, has announced the addition of a high retention Type B USB interface (USBR Series) that complies with the class 1, Div II minimum withdrawal requirement of 15 Newtons.

High density interconnect arrays (2-Mar-2006)
SAMTEC’S new Searay high density interconnects (SEAM/SEAF Series) provide a solid grid of contacts on 1.27mm pitch and up to 500 I/Os. These connectors are the same footprint as the popular SamArray Series connector, but with added features and stack heights.

High density differential arrays (3-Feb-2006)
SAMTEC’S new Differential Pair Arrays (DPAM/DPAF Series) provide performance of up to a terabit per connector with up to 168 usable signal pairs. The signal pairs are on a staggered layout with perimeter grounds to reduce the overall number of grounds needed as well as simplify signal routing on the boards.

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