SAMTEC and Teraspeed signal integrity engineers have jointly developed a robust process that uses advanced 2D, 3D, frequency domain and time domain modeling, simulation, and measurement techniques that reduce risk in the development of high performance systems of 10Gbps and above.
This process can be seen in Samtec's Final Inch signal integrity offering for the QStrip, Qpair, and SamArray connector families.
The importance of modeling that is appropriate to the system elements being modeled will be discussed, including how to combine these modeling elements into a hybrid unified time domain simulation environment using HSPICE.
The design of transparent measurement and validation boards will be described and stunning correlation shown between measured and simulated performance in the time and frequency domain for busses designed with standard high volume, low cost board-to-board connector systems.
S-parameter data from these test boards will be shown to match solutions generated from electromagnetic field solvers and simulation. In addition, time domain measurements will show near-exact correlation between simulation and measurement.
Finally, real eye pattern measurements of an operating 10Gbps board-to-board system will be demonstrated to show the power of this hybrid methodology in characterising and optimising design performance.