SAMTEC has released the SAL1 low-profile, high-speed, Micro Card socket interface. It provides a card-to-board interface for serial ATA and other high-speed daughtercard applications.
The interconnects are used in pairs and have large deflection, beryllium copper contacts on 1mm pitch. They are designed to mate with either 1.60mm-thick or 2.4mm-thick cards. They can be mounted on the same side of the board or opposite sides to increase signal routing flexibility. The connector's design also allows the card to be mated from both sides of the board. It has weld tabs on both ends for soldering to the board. Four standard pin counts are available with a choice of 20, 27, 30, and 40 I/Os per side. These are pass-through interfaces and can be used for multi-level board stacking.