ST’s new Sound Terminal digital audio System-on-Chip (SoC) is at the core of extremely slim home audio designs, supporting up to 50W of output power with no external heatsink required.
Consumers of high-end audio systems such as personal music players and high-definition multimedia expect audiophile sound quality from music docks, sound bars and digital active speakers.
Highly efficient class-D amplifiers in ST’s audio ICs produce very little heat, enabling the miniature heatsink and enclosure sizes.
The new Sound Terminal IC, the STA350BW takes this efficiency to a new level, allowing heatsink-free design up to 50W for ultimate slimline styling.
Key features of ST’s STA350BW Sound Terminal ICs:
- Digital audio processing on the chip
- Multiband Dynamic Range Compression (MDRC) boosts audio clarity and system reliability
- SoC compensates non-ideal speaker characteristics
- Optimised low-frequency response for outstanding bass performance
- Integrated protection features safeguard the system against a wide range of fault conditions
- Run-time automatic diagnostic circuitry helps prevent failures and boosts the overall reliability of the application
- Uses ST’s FFX technology to stream full digital audio to the speakers
- Increases flexibility for configurable products by providing four selectable run-time output configurations supporting a choice of operating modes
- 50W stereo output with no heatsink required
- FFX technology digital audio streaming to speakers
- Pin and software compatible with Sound Terminal family ICs
- PowerSSO 36-pin slug-down package supporting convenient low-cost system design
- Design support provided through ST’s integrated development suite, APWorkbench