Home > SenseAnywhere achieves advanced single chip integration in new wireless modules

SenseAnywhere achieves advanced single chip integration in new wireless modules

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article image The SenseAnywhere AiroSensor and AssetSensor active-RFID modules integrate ST’s BAL-CC1101-01D3 balun

Global semiconductor leader, STMicroelectronics Pty Ltd announced that SenseAnywhere has qualified the world’s first wireless devices incorporating ST’s new single-chip balun. SenseAnywhere specialises in tags and modules for wireless sensing and location.

The SenseAnywhere AiroSensor and AssetSensor active-RFID modules integrate ST’s BAL-CC1101-01D3 balun, which balances the connection between the radio and antenna, replacing discrete components that would occupy up to 30mm² of PC board space with a single integrated circuit featuring a footprint of 2.1mm². Single chip integration enables closer impedance matching, greater stability, and reduced device-to-device spread by minimising variations between circuit features on the same silicon substrate.

The two SenseAnywhere modules enhance performance and save cost in Internet of Things (IoT) applications by combining advanced RF transceiver technology with a low-power processor, low-voltage EEPROM, and miniature temperature, humidity, and ultra-efficient motion sensors. IoT applications include environmental monitoring, cold chain compliance, theft protection, and asset tracking among many more.

SenseAnywhere Founder and Managing Director Tom Heijnen commented that ST’s cooperation made it possible for them to achieve significant improvements in the output performance, sensitivity and impedance matching of their RF modules and sensors while also minimising unwanted harmonics. ST’s balun also helped them reduce overall application size, which has resulted in significant savings in bill-of-materials costs and reduced assembly and testing costs.

The first in a new family of integrated baluns from ST, BAL-CC1101-01D3 is optimised for ultra-low-power applications in sub-GHz Industrial, Scientific and Medical (ISM), and Short-Range Device (SRD) frequency bands, delivering advantages such as an integrated harmonic filter for improved harmonic attenuation, low insertion loss, and operation up to 85°C.

According to Richard Renard, Senior Product Marketing Engineer, STMicroelectronics, the advanced single-chip integration of their new balun family helps customers overcome significant RF system design challenges to deliver higher-performing products while reducing cost and time to market.

ST additionally contributed its compact, flexible, and lowest-power LIS2DH accelerometer, and low-power EEPROMs to the SenseAnywhere IoT modules to ensure long-lasting and accurate performance. 

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