ST Microelectronics specialises in the supply of MEMS sensors for consumer and portable applications.
Benedetto Vigna, Group Vice President and General Manager of ST Microelectronics’ MEMS, Sensors and High Performance Analog Division will deliver the opening keynote speech at the SEMICON Taiwan 2010 MEMS Forum to discuss the challenges of sensor integration and the trends for future smart-sensor solutions, with a key focus on the application requirements of the mobile market.
Micro-Electro-Mechanical Systems or MEMS technology, products and applications are developing rapidly following the phenomenal success of applications such as gaming platforms and smartphones.
According to iSuppli, the MEMS market continues to grow in 2010 and beyond with revenues expected to reach US$1.5 billion in 2010 and more than US$3 billion by 2014.
The continued demands from consumer and mobile applications dominate the growth and these fields are expected to become the biggest MEMS segment by 2014.
According to Benedetto Vigna, ST has manufactured more than 850 million units of MEMS including both accelerometers and gyroscopes, and has 50% share in consumer and mobile MEMS market in addition to 21% in all other markets such as automotive and industrial.
“We are the first company to enter the mobile phone market with a 3-axis digital gyroscope and by the end of 2010, we will have shipped over one billion MEMS sensors in all applications. We also intend to exploit the economy of scale resulting from our huge success in the consumer field to address other markets such as healthcare, industrial and automotive.”
As the one-stop MEMS supplier of choice, ST is paving the way to smart sensor modules.
With its high degree of sensor and application expertise, scalable manufacturing capability, especially at the assembly and testing level, ST is able to provide integrated system solutions in a package that includes various components such as accelerometers, gyroscopes, compasses, pressure sensors, temperature sensors, microphones, microcontrollers, interface ICs and connectivity components that enable wirelessly interfacing the systems with the outside world.
The integration of multiple MEMS sensors into a package on top of the miniaturisation and cost advantages can benefit customers in many ways:
- Reduced design cycle time
- Ability to sense many degrees of freedom enabling a larger number of applications
- Shorter application development time
- Reduced number of external components
- Higher performance and reliability
- Easier assembly, which decreases the failure rate during the assembly itself