Leading global semiconductors specialist, ST Microelectronics has expanded its portfolio with a new device that combines three-axis sensing of both linear and angular motion. ST’s high-performance multi-sensor modules with six degrees of freedom target advanced motion-sensing applications including remote controls, black box recorders and enhanced GPS systems.
ST Microelectronics serves customers across the spectrum of electronics applications and is also the leading supplier of MEMS (Micro-Electro-Mechanical Systems) for consumer and portable applications.
ST’s LSM330DL multi-sensor modules detect acceleration up to 16g and angular rate up to 2,000 dps along the pitch, roll and yaw axes. The integration of a 3-axis digital accelerometer with a 3-axis digital gyroscope in a single device increases system robustness while the advanced design of the mechanical sensing structure guarantees excellent thermal and mechanical stability.
With its inherently precise and highly reliable alignment of the sensors, ST’s six-axis motion-sensing module is superior to discrete solutions where mounting of multiple components in one package induces random alignment errors of the two sensors’ reference axes.
ST’s newest gyro-accelerometer 6-axis combo chip targets a wide range of applications:
- Intuitive user interfaces in pointers and remotes
- Motion monitoring in black-box recorders
- Dead-reckoning and map-matching in advanced navigation systems
- Smart power-saving and free-fall detection in portable electronics
Key features of ST’s LSM330DL multi-sensor modules:
- Addresses energy efficiency on chip and at the system level
- Motion-sensing modules include power-down and sleep modes
- Embedded FIFO (first-in first-out) memory block removes the need for continuous communication between module and host processor
- Can operate with any supply voltage in a 2.4V - 3.6V range
- Leverages the same micromachining technology process that has been successfully applied to more than 1.4 billion motion sensors in the market
- Pin-to-pin and software-compatible with the recently announced five-degrees-of-freedom LSM320DL module, enabling ‘hot swap’