ST Microelectronics has introduced small single-chip camera sensor for mobile applications. Coupling low space requirements with image processing capabilities, ST Microelectronics recent 2-megapixel mobile-phone camera sensor addresses consumer’s appetite for imaging solutions in thin-profiled handsets.
ST Microelectronics VD6725 is a 1/5-inch optical-format imaging sensor, with an active pixel array of 1600 x 1200 (UXGA), an image processor and camera control functions on a single chip.
The VD6725 fits in phone camera modules smaller than 6 x 6 x 3.8 mm due to its 1.75-micron pixel design and ST Microelectronics’ sensor architecture.
ST Microelectronics new developments in pixel defect correction, adaptive noise reduction and sharpness enhancement ensure that the embedded image signal processor delivers picture quality.
Advanced anti-vignetting algorithms (balancing uneven illumination) and automatic white-balance control support colour rendition in varying light conditions. The camera sensor is also able to identify and neutralise defective (dead) pixels that fail to sense light levels correctly.
The VD6725’s embedded image processor enables the users to apply a wide range of special effects on snapshots, including flipped and mirror-reversed images or pure black-and-white conversion for whiteboard content capture, document extraction and barcode reading.
ST Microelectronics new single-chip camera sensor produces digital video streams at 15 frames per second (fps) at full UXGA resolution and 30 fps at VGA resolution.
It supports fast context switching, which means that the sensor switches fast from preview to capture mode, minimising the delay of the capture control.
The VD6725 single-chip camera sensor is available in ST Microelectronics TSV (Through Silicon Via) wafer-level package. This type of package enables the production of reflowable camera modules.
These are soldered directly on the phone motherboard, which saves cost, space and time. ST Microelectronics have reflowable camera modules in production.
In addition to mobile phones, the VD6725 can be used in a wide range of portable devices such as laptop cameras, PDAs and mobile gaming platforms.
Engineering samples and demo-kits are available now, with the volume production scheduled for the end of June 2008.
ST Microelectronics VD6725 single-chip camera sensor is available in two package options, as a COB (Chip On Board) die or in the TSV wafer-level package.