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ST Microelectronics’ flip-chip package delivers space and cost savings in consumer application design

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By combining EMI filtering and ESD protection for 10 high-speed signal lines in a 1.98 x 2.08mm flip-chip package, the EMIF10-LCD03F3 from ST Microelectronics , suppliers of integrated passive and active devices (IPAD), saves up to 80% of board space and 49 components over an equivalent discrete network, and achieves higher attenuation in the stop band.

By achieving better than -40dB attenuation in the mobile frequency range 900MHz to 3GHz, the EMIF10-LCD03F3 outperforms discrete filters, delivers size and cost reductions, and enhances reliability in equipment such as:

  • Cameras
  • Cell phones
  • Portable media players
  • GPS receivers
  • Home entertainment products
  • Digital displays
With bandwidth of 200MHz at -3dB, 30pF maximum line capacitance, and 6ns maximum rise and fall times, the EMIF10-LCD03F3 provides transparent EMI filtering for high-speed signals.

The EMIF10-LCD03F3 withstands +15kV contact discharge at inputs and outputs exceeding IEC61000-4-2 Level 4, the highest safety standard for ESD protection. The device’s low clamping voltage also exceeds the performance of typical discrete networks, delivering a further improvement in protection and reliability while maintaining signal integrity.

The second-order, RLC low-pass filters are fabricated using LC (inductance/capacitance) cells in ST Microelectronics’s technology, achieving high filter performance within a smaller silicon area than existing alternatives.

By implementing 10 individual second-order filters with ESD protection in a 24-bump, 0.4mm-pitch flip-chip package of 0.6mm profile, the EMIF10-LCD03F3 saves both footprint and height to enable miniaturisation of ESD-sensitive equipment requiring high EMI filtering.

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