ST Microelectronics is a global leader serving customers across the spectrum of electronics applications with innovative semiconductor solutions.
A major provider of high-performance System-on-Chip (SoC) ICs, the company has announced full availability of a 32-nanometer (nm) technology platform for the design and development of leading-edge application-specific integrated circuits (ASICs) for networking applications.
Central to the new 32nm SoC design platform, which implements ST’s 32LPH (Low-Power High-performance) process technology is the industry’s first Serializer-Deserializer (SerDes) IP available in 32nm ‘bulk’ silicon.
Enabling very large ASIC designs, greater than 200mm², ST’s new 32nm 32LPH ASIC design platform enables an unprecedented mix of high performance, high complexity, low power consumption and reduced silicon real estate per functional block.
The platform is designed to accelerate the development of next-generation networking ASICs used in high-performance applications such as enterprise switches, routers and servers as well as optical cross-connect and wireless infrastructure applications.
“With the introduction of the 32LPH platform, ST is enabling the next generation of equipment for communication infrastructure applications, which requires highly integrated ASICs that can satisfy the increasing demand in performance, while also meeting extremely challenging power consumption and silicon integration goals,” said Riccardo Ferrari, Group Vice President and General Manager of ST’s Networking and Storage Division.
“We are extremely encouraged by the strong interest that customers are demonstrating for this platform, which has already gained key design wins.”
ST’s SerDes IP, called S12 is a key piece of intellectual property that has already been successfully demonstrated in labs at selected key customers.
The S12 IP is vital for the development of ASICs for networking applications and enables chip-to-chip, chip-to-module and backplane communications in networking equipment designs.
“ST is the first silicon supplier to bring a full design platform in a 32nm bulk-silicon process technology to the communication infrastructure market, including a next-generation predictive ASIC top-down design methodology, together with a full set of proven IP such as a SerDes and embedded DRAM, successfully developed over many years by ST in previous technology nodes,” said Philippe Magarshack, Technology R&D Group Vice-President, Central CAD & Design Solutions GM, ST Microelectronics.
The first ASIC prototypes implemented in ST’s 32LPH process technology are expected early in 2011 with production ramp-up in the second half of 2011.