Home > Photoelectric sensors from SICK for wafer and biscuit baking plants

Photoelectric sensors from SICK for wafer and biscuit baking plants

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article image Haas relies on two product families of photoelectric sensors from SICK to detect various baked goods
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SICK presents a range of robust photoelectric sensors designed to withstand the high temperatures, harsh ambient conditions and challenging tasks in industrial baking machines.  

Sensors from SICK are the preferred choice at Franz Haas Waffel- und Keksanlagen-Industrie GmbH in the Austrian town of Leobendorf.  

According to Martin Kopf, Head of Electric Construction at Franz Haas Waffel- und Keksanlagen-Industrie GmbH, Haas’ wafer and biscuit baking plants are equipped with high-performance solutions for fully automated baking of diverse products such as wafer sheets, biscuit and cake products, wafer cones and pancakes in large-scale industrial production processes.  

Their sensor technology therefore needs to recognise the diverse baked goods while coping with different shapes, sizes, degrees of browning, and surface structures.  

The objective of automation technology employed at Haas’ plants is to have rugged and low-maintenance sensor solutions that can be used across facilities if possible, despite the product variety and many different processing steps and ambient conditions.  

Haas uses two product families of photoelectric sensors from SICK for diverse detection tasks including detecting dough strands, pre-formed dough pieces, wafer sheets, cookies and cones.  

The two families of photoelectric sensors from SICK include WTB12-3 and W12L-2 Laser sensors that have displayed superior detection performance across different products, assuring the company of high product output, as well as simple operation and commissioning.  

The optical sensors are selected based on the facility environment and the baked goods. For instance, a photoelectric sensor with background suppression is used on chocolate cookies that need to be detected on a light conveyor belt. Alternatively, for flat wafers or lye bread with its dark, shiny surface, sensors with foreground suppression are the best choice.  

ECOLAB tests have confirmed the ruggedness of the photoelectric sensors, as they reliably and permanently fulfil the requirements of material stability such as those entailed in cleaning and disinfecting processes in the food environment.  

By using the sensors from the WTB12-3 product family in two versions as well as the W12L-2 Laser, the Haas Company has successfully and reliably been able to perform highly diverse tasks associated with the detection of baked goods in the high-performance baking machines.  

Additionally, SICK’s global presence ensures quick replacement of the sensor devices in the event of any problem. 

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