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Single chip, CMOS Bluetooth solution

SILICON Wave and RF Micro Devices, represented by RF Parts Australia , has introduced the SiW3500 UltimateBlue IC, a complete single-chip CMOS Bluetooth solution.

The SiW3500 UltimateBlue IC.

The SiW3500 helps speed time to market and implements new features found in Bluetooth specification version 1.2, including faster connecting times, Adaptive Frequency Hopping (AFH) for improved coexistence of Bluetooth with other 2.4GHz devices, and extended SCO for improved voice transmissions.

The integrated circuit combines a direct conversion radio modem with an ARM7TDMI processor core, Bluetooth baseband logic, and complete protocol software in ROM.

The SiW3500 chip is a complete platform that can execute additional upper layer protocol stack and application software functions, including additional complex audio processing algorithms such as noise cancellation without a separate DSP.

The SiW3500 UltimateBlue single-chip Bluetooth IC is compliant with Bluetooth specification version 1.2 mandatory and optional features including Adaptive Frequency Hopping (AFH), and extended SCO (eSCO).

The device features a direct conversion architecture with good receiver blocking performance optimised for RF hostile environments within mobile phones.

The on-chip 50Ω RF matching network requires no external matching component for direct connection to an antenna. On-chip ROM storage is also featured with dynamic software patch capability.

The SiW3500 supports all standard mobile phone reference clock frequencies.

The device also offers fast hardware-based Automatic Gain Control (AGC) circuit that dynamically adjusts the receiver for optimal performances.

The integrated 32-bit ARM7TDMI processor core enables an open software development platform facilitating the integration of upper layer stack and profiles.

Built-in UltimateBlue coexistence technology software reduces interference to 802.11 devices.

The temperature compensation circuit stabilises performance from -40°C to +85°C. An extended high temperature range to +105°C is available.

The device has a 96-pin 6mm x 6mm VFBGA package, and bumped die option.

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