RF Micro Devices has released linear power amplifier (PA) modules for CDMA applications, including 3V IS-95/CDMA 2000 1X handheld digital cellular equipment and spread-spectrum systems.
The RF3163, RF3164, and RF3165 PA modules are manufactured with a gallium arsenide heterojunction bipolar transistor process.
The 3mm x 3mm x 0.9mm modules are based upon lead frame module (LFM) packaging technology. LFM eliminates surface mount devices and their associated costs by integrating the functionality of passive components into the GaAs die manufactured by RFMD. The modules do not require laminate or low temperature co-fired ceramic substrates or surface mount components. This simplifies the production supply chain and decreases manufacturing lead time.
The modules offer good thermal dissipation, moisture sensitivity level, and electrostatic discharge sensitivity. They feature MSM-driven digital control lines to lower quiescent current for increased talk time in low power conditions. They are self contained with 50Ω input and output and are internally matched to obtain optimum power, efficiency, and linearity.