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Mechanical board failure testing

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article image Can withstand large temperature cycling.

BOUNDARY, component, and function testing of printed circuit boards, provide essential insurance against early failure, however, mechanical testing is becoming more important as component densities increase.

Electronic and mechanical testing can be combined by mounting the board under test in a cantilevered or two-support beam position and subjecting it to an oscillating force, suggests Power Parameters .

Electronic and mechanical testing offers information regarding reliability and incipient failure modes with track breakage, SMD, and pin joint failures, to name a few.

The board to be tested is subjected to various vibration frequencies and known micro-strain values as measured by strain gauges mounted on the board. The strain gauges (Kyowa SKF and KFRS series) have small footprints with the KFRS (1.2mm x 1.1mm) being suitable for on-device mounting as well in-between device spaces.

The strain gauges are designed to mimic the expansion coefficients of PCB materials and can withstand large temperature cycling (from -30°C to +120°C for the KFRS), thus permitting testing in environmental chambers.

The strain gauges can be interfaced to a computer using the Kyowa PCD-300A interface or, alternately, to the Kyowa 32 channel or 64 channel version EDX-2000A memory recorder/analyser, which provides FFT and histogram analyses as well as permitting other mathematical manipulation.

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