ROYAL Philips Electronics has released bulk acoustic wave (BAW) filters and duplexers that significantly enhance the performance of multimedia mobile phones. The filters use reduced form factor chip-scale packaging technology, improving the performance and reception of GSM and 3G mobile phones while reducing space in mobile handset designs.
The filters outperform SAW and dielectric filters to offer smaller size, reduced in-band insertion loss and increased steepness of the filter skirts in lower and upper transition bands.
As the industry moves toward 3G voice and data services, real estate within the mobile handset is at a premium. The BAW filters and duplexers simplify the design process and provide a size reduction in the RF module, which is usually the largest component on a mobile phone board.
Philips' solder bumped chip-scale packaging reduces manufacturing costs of the RF front-end compared with currently available wire-bonded BAW filters. By using Philips' passive integration process technology, manufacturers can more easily integrate baluns, saving space, cost and time.