Tower Semiconductor has licensed Motorola ’s all-copper, 0.13-micron HiPerMOS7 (HiP7) CMOS process technology with prototyping on it to begin as early as first quarter 2003.
The technology transfer, to be completed in the fourth quarter of next year, will be used by Tower for its analogue, digital and mixed-signal processes, as well as for its proprietary CMOS Image Sensor and microFLASH technologies, according to Tower co-ceo Dr Yoav Nissan-Cohen.
“We now have access to industry-leading 0.13-micron process technology, as well as the benefit of Motorola’s extensive experience with copper interconnect technology,” Dr. Nissan-Cohen said.
“This will enable us to accelerate our support of new and existing customers at the 0.13-micron technology node, while extending an already productive relationship with long-time partner and customer Motorola.”
The agreement also calls for the two companies to further enhance the technology to provide compatibility with the widest range of industry-standard design tools and services.
The technology is expected to be developed at a Motorola facility concurrent with HiP7 transfer, Dr Nissan-Cohen said.
By using Motorola’s existing base line technology process, Tower expects to expedite the development of this critical technology, Dr Nissan-Cohen added.