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Rugged 6U VPX XMC Carrier Card for Sophisticated High performance systems

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article image Rugged 6U VPX XMC Carrier Card

PEX441 offers excellent thermal performance enables power densities up to 30 watts/XMC  

GE Fanuc Intelligent Platforms, a unit of GE Enterprise Solutions, has recently announced the PEX441 rugged 6U VPX XMC Carrier Card. Designed to enable system architects and integrators to include a broad range of high performance XMCs in their designs, the PEX441 is specifically optimized for excellent thermal performance, with the capability to enable power densities of up to 30 watts per XMC. One or two can be accommodated. Typical XMC applications will include system I/O, FPGA processing, graphics and digital/analog interfaces.  

The PEX441 supports a broad range of flexible I/O options, allowing systems designers a choice of switched fabric topology.  

High performance mezzanine cards are becoming increasingly prevalent as designers look to create sophisticated systems that are extremely functionality-dense. However, this density creates problems with managing power and heat dissipation – a key design issue – if maximum reliability is to be achieved. The PEX441 addresses this requirement by supporting the use of high performance XMCs on a carrier card that can cater for challenging power densities.  

The PEX441 is available in five build levels, providing a cost-effective choice between platforms for benign environments through systems that will be deployed in harsh environments. It is optionally compliant with the VITA 48/REDI specification for rugged systems.  

Designed to support leading edge XMCs such as GE Fanuc’s Xilinx Virtex-5 based XMCV5, the PEX441 allows system designers to migrate their XMC laboratory systems to a rugged, deployable 6U VPX form factor in order to exploit the full complement of high speed digital I/O available through a standard VPX backplane. It extends the functional envelope of a 6U VPX system by leveraging an array of Ge Fanuc- or customer XMC modules into a distributed, fabric based architecture, removing the need to host high power mezzanines on high power CPU cards. Thermal load can be spread across multiple system slots for both air- and conduction cooled applications supporting high computer density.    

GE Fanuc Intelligent Platforms is represented in Australia and New Zealand by Metromatics

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