Home > Aaeon, Adlink, Advantech and Kontron Australia jointly release nanoETXexpress 1.0 specification

Aaeon, Adlink, Advantech and Kontron Australia jointly release nanoETXexpress 1.0 specification

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The small Computer-on-Modules form factor, nanoETXexpress (84mm x 55mm), originally initiated by Kontron Australia , is gaining momentum and acceptance in the market. The embedded Computer-on-Modules vendors Aaeon, Adlink and Advantech together with Kontron Australia have jointly released revision 1.0 of the nanoETXexpress specification, which now includes SDVO support. They will present the nanoETXexpress form factor to the PICMG consortium for incorporation into one of the next COM Express releases under the proposed neutral name ‘Ultra’.

Future-proof design, maximum reliability and longevity are some of the high quality features of the nanoETXexpress form factor that have inspired Aaeon, Adlink, Advantech and Kontron Australia to work together on revision 1.0 and push for its incorporation as ‘Ultra’ along with the slightly larger ‘Compact’ module (95mm x 95mm) into the COM Express specification. Currently, the COM Express specification includes only the ‘Basic’ (95mm x 125mm) and ‘Extended’ (110mm x 155mm) form factors.

Aaeon support the ‘Ultra’ form factor because it fits into their product portfolio. They have already implemented the Intel Atom processor on the COM-U15 COM Express Computer-on-Module. The step to implementing the nanoCOM-U15 was therefore easy.

According to Adlink, by proposing this new ‘Ultra’ small form factor that remains fully pin and signal compatible with PICMG's COM Express Type 1, they can leverage COM Express success and use its existing design ecosystem and collateral. The COM Express compatible connectors, with their higher EMC, inherently make ‘Ultra’ a future proof design for the small form factor Computer-on-Modules market.

The small nanoETXexpress Computer-on-Modules offer maximum graphic flexibility as reflected in the new SDVO support, at a low cost. Revision 1.0 of the nanoETXexpress Computer-on-Modules specification enables SDVO signal transport through a separate flat foil connector. The LVDS output on the COM Express connector can therefore also be retained and used alongside DVI, giving designers the possibility of designing-in extra graphic interfaces on the carrier board to enable dual display solutions.

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