INTERNATIONAL Rectifier (IR) has launched the smallest Schottky diode in the industry.
The IR140CSP FlipKY device uses standard ball-grid array (BGA) technology and occupies a total area of 2.25mm2, or 86% smaller than the standard SMA package, and as much as 32% smaller than similar competing lead-less devices.
The 1A, 40V Schottky diode is a four-ball, 1.5mm x 1.5mm device with a profile of less than 0.8mm.
The FlipKY revolutionises the low power Schottky diode market by eliminating the lead frame and epoxy traditionally used in other devices.
The FlipKY is suitable for hand-held, portable equipment such as cell phones, PDAs, notebook computers, hand held computers, MP3 players and hard disk drives where the small size is crucial to equipment success.
BGA technology enables size reduction and better heat transfer away from the die junction to the circuit board.
Moreover, since this device is made with true chip scale packaging, it dissipates heat directly from the die into the air, increasing thermal efficiency.
In fact, thermal resistance junction-to-ambient is rated at 75°C/W maximum and thermal resistance junction-to-PCB is typically 55°C/W.
Since the IR140CSP is so small, it allows strategic placement on the circuit board, drastically reducing stray inductance and increasing overall circuit efficiency.
The FlipKY device is lead-less and minimises lead inductance compared to all lead frame and axial packages.