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Intel holds Spring Intel Developer Forum in Beijing, China

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Intel held its Spring Intel Developer Forum on April 17th and 18th in Beijing, China. Listed below are brief summaries of each executive’s keynote speech and the major news disclosed.

David Perlmutter and Anand Chandrasekher- Where does wireless go from here?

Intel Senior Vice President and General Manager, Mobility Group and Intel Senior Vice President and General Manager, Ultra Mobility Group

Describing new trends in mobile computing, Perlmutter said that personal computing is increasingly going mobile, noting that notebook shipments are projected to outpace desktop by 2011.

Perlmutter highlighted forthcoming Intel platforms for notebooks that builds on the mobility attributes of performance, battery life, form factor and wireless communications, and also how these attributes can be extended to new device types and usage models.

He also discussed the future of wireless networking connectivity, including mobile WiMAX. Chandrasekher discussed the evolution of personal mobile internet, the drastic reductions Intel is making in power and package in its silicon roadmap.

In May Intel will launch next generation Intel Centrino processor technology codenamed Santa Rosa. It is comprised of a next generation Intel Core 2 Duo processor, the Mobile Intel 965 Express chipset family, Intel Next-Gen Wireless-N network connection, Intel 82566MM and 82566MC Gigabit Network Connection, and optional Intel Turbo memory.

Perlmutter demonstrated the decreased resume time from a notebook with Intel Turbo memory in hibernation increasing productivity and reducing system power consumption.

Future mobile roadmap for notebooks – Perlmutter outlined the Intel mobile technology roadmap that follows the upcoming Santa Rosa launch.

In the first half of 2008, Santa Rosa will be refreshed with the 45nm Hi-k Intel dual core mobile processor, codenamed Penryn.

Later in 2008, Intel will deliver Montevina processor technology, also with the 45nm Hi-k Intel dual core mobile processor. This will be Intel’s first Centrino processor technology for notebooks to offer the option of integrated Wi-Fi and WiMAX wireless technologies for greater wireless broadband access. With approximately 40% smaller components, Montevina will be ideal for mini- and sub-notebooks, and will include integrated hardware decode for high-definition video.

WiMAX for Notebooks in 2008 –Perlmutter said that mobile WiMAX will deliver the true Mobile Internet and make broadband personal. In a technology demonstration, Perlmutter showed for the first time Intel’s mobile WiMAX with MIMO technology solution integrated into a concept Centrino-based notebook. Intel plans to make WiMAX an option with its Montevina processor technology for notebooks due in 2008.

Intel ’07 ultra-mobile platform arrives – Chandrasekher introduced the Intel Ultra Mobile platform 2007 (codenamed McCaslin) for Mobile Internet Devices (MIDs) and Ultra-Mobile PCs (UMPCs), with systems available over the summer from Aigo, Asus, Fujitsu, Haier, HTC and Samsung, all based on Windows Vista and the Origami Experience.

The Intel Ultra Mobile platform 2007 is based on the Intel processor A100 and A110, the Intel 945GU Express Chipset and the Intel ICH7U I/O Controller Hub, where the power and package have been optimised for unique ultra-mobile requirements.

Next-Generation Menlow in 2008 – Intel will pull in its next-generation platform for MIDs and UMPCs, codenamed Menlow, from late 2008 to the first half of 2008. Menlow will include a new processor, codenamed Silverthorne, based on a new 45nm Hi-k low power microarchitecture. The platform also includes the next-generation chipset, codenamed Poulsbo, providing a single-chip solution.

Silverthorne and Poulsbo were both designed from the ground up for MID and UMPC platforms. Chandrasekher demonstrated Menlow-based prototype.

Alliance to drive mobile internet innovation – Comprised of such industry-leading original design manufacturers as Asus, BenQ, Compal, Elektrobit, HTC, Inventec, and Quanta, Intel announced the formation of the Mobile Internet Device Innovation Alliance.

Members of the alliance will work together to solve engineering challenges associated with delivering the full Internet in ever-smaller MID form factors including power management, wireless communications, and software integration. Alliance members are expected to launch Menlow-based products in the first half of 2008.

Intel mobile internet ecosystem growing – A sign of the growing momentum behind the MID and UMPC categories, Chandrasekher said Intel is working with such companies as Adobe, Hanwang, Lingtu, MobiTV, Samsung Displays, Tencent, and Tom.com to enable enhanced and optimised displays, applications and services for a simplified, rich consumer experience.

He also outlined Intel’s intent to pursue Linux as an OS alternative for MIDs and announced the support of Red Flag and Canonical, provider of the popular Ubuntu Linux OS, as Linux OS vendors.

Mark Bohr- Silicon technology leadership and the new scaling paradigm
Intel Senior Fellow, Technology and Manufacturing Group

Intel introduced strained silicon technology on 90nm and now it has introduced high-k metal gate transistors on 45nm. Intel Senior Fellow Mark Bohr provided a technical view into these achievements.

Intel has a silicon research and technology pipeline that will continue to produce a new process technology every two years, in accordance with Moore's Law. Mark will describe how transistor scaling has changed and some of the technologies being explored for future advancement.

45nm for Ultra-Mobility- Bohr said that Intel now has working versions of a new 45nm processor, codenamed Silverthorne, based on Intel’s revolutionary Hi-k Metal Gate transistor technology and a new low power microarchitecture for UMPCs and MIDs.

Silverthorne joins Intel’s already working versions of its 45nm Hi-k Intel Core 2 Duo, Core 2 Quad and Intel Xeon family of processors (codenamed Penryn) optimised for mobile, desktop, workstation and servers systems.

Intel 45nm High-k metal gate transistor technology for energy efficiency, Intel's 45 nm technology uses the company’s high-k metal gate transistors that provide a breakthrough in energy efficient silicon technology.

Bohr reiterated that Intel's 45nm technology is on track for production in the second half of this year, with two factories up and running in the second half of this year with two more in production by the second half of 2008.

Future Silicon Technology Research - Bohr outlined several options that Intel continues to research and consider for future technology generations to deliver the benefits of Moore’s Law, including tri-gate transistors, Indium Antimonide (InSb) quantum well transistors and carbon nanotube interconnects.

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