Hitachi has announced it will transfer the opto-device division of its semiconductor and integrated circuit (SIC) business group to OpNext as early as October 2002.
The transaction will cover SIC’s opto-device division as well as the opto-electrical device development and manufacturing team and fab facilities from Hitachi Tohbu Semiconductor, according to OpNext president and ceo Harry Bosco.
“The transfer of the opto-device division and its technology brings our customers proven, advanced IC technology that will be a perfect complement to our existing optical components business,” Bosco said.
“Along with our new division comes world-class expertise in system LSI as well as demonstrated competence in mass producing high quality optical devices”.
“This merger is in line with Hitachi’s strategic vision for OpNext to maximise the value of its technology assets and create a world-class customer focussed organisation,” Bosco said.
SIC designs, manufactures and sells devices and modules for the access communication, fibre-optic backbone and metro markets, in addition to the information and industry markets.
The transfer of the opto-device division to OpNext will strengthen OpNext’s market position and enhance its current product portfolio consisting of transceivers, transmitters, receivers and laser diode modules.
All of SIC’s existing customers will be fully supported by OpNext after the merger, Bosco said.
OpNext was formed from Hitachi’s fibre optic components business last year.