Farnell introduces protective peel packaging for integrated circuits
Farnell , part of the Farnell Group, has launched an innovative peel packaging solution for the Australian and New Zealand markets, designed to protect fragile integrated circuits (ICs) during shipping, storing, and handling.
Currently, this new solution is available for ICs with case sizes measuring 12mm x 12mm and 14mm x 14mm. The ICs are placed within protective recyclable plastic cells, which are then sealed with an anti-static lid.
Offered at no extra charge, peel packaging provides a reduced risk of moisture ingress and easy product identification: Farnell’s stock number and the manufacturer’s part number are clearly marked on the back of the package.
Prior to implementing peel packaging, Farnell conducted extensive customer research, which concluded that no single packaging solution works ideally for every IC size, shape, and pin configuration. The research also confirmed that cut tape remains a suitable choice for most smaller-sized IC devices, and Farnell will soon expand its product range available in this format.
“We’ve learned that innovation and versatility trumps a ‘one size fits all’ approach when it comes to packaging ICs”, comments Peter Davis, Director of Product Development. “And as a Premier Farnell company, we are committed to further improving packaging materials for our entire offering.”
The patent-pending peel packaging was developed in-house, in partnership with Farnell’s sister North American Business, Newark and Antistat, a company providing supply chain and packaging solutions to the electronics, medical, and automotive markets.
2-Jul-2008