Electrolube Australasia have launched two new thermal management solutions: HTCX and HTCPX. HTCX and HTCPX are enhanced versions of the well established products HTC and HTCP. Both HTCX and HTCPX feature improved thermal conductivity, lower oil bleed, and lower evaporation weight loss compared with HTC and HTCP.
Most components have a maximum effective operating temperature. Failure to maintain the temperature below this maximum can lead to increased failure rates and variation of electrical properties. The range of applications incorporating the use of a thermally conductive material has increased as electronic circuits have become smaller, more complex and powerful. These advances have generally resulted in greater heat generation.
Heat generated within components is conventionally removed by the use of metals, either formed to give high surface areas (heatsinks) or to form part of the assembly’s outer body. The hot component is mechanically attached to the metal but invariably there is always an air gap between the surfaces. As air is a poor conductor of heat, this air gap greatly reduces the rate of heat dissipation. The application of HTCX or HTCPX fills the gap, excluding air.
HTCX and HTCPX both have been specially formulated by using a proprietary additive to provide a significant increase in thermal conductivity without sacrificing the viscosity / consistency or film thicknesses associated with the original products. The ultimate in thermal conductivity, and other exceptional properties, obtained from HTCPX are also due to the novel use of various metal oxide (ceramic) powders. These two materials are electrically insulative to ensure that leakage currents can not be formed if the paste should come into contact with other parts of the assembly.
HTCX and HTCPX are recommended where the efficient and reliable thermal coupling of electrical and electronic components is required and between any surface where thermal conductivity and heat dissipation is important. They should be applied to the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicone rectifiers and semi-conductors, thermostats, power resistors and radiators. HTCPX can also be used as thermal conductive gap filler.
Both HTCX and HTCPX contain no silicones and cannot migrate onto electrical contacts with consequent high contact resistance, arcing or mechanical wear. Similarly, soldering problems caused by silicones will not be encountered. Economic in use, safe and easy to use and the white colour enables treated parts to be easily identified.
A full range of heat transfer products are available from Electrolube. This range includes silicone based pastes for very high temperature applications (HTS / HTSP), a RTV rubber (TCOR), an adhesive epoxy (TBS) and an epoxy based potting resin (ER2074). For more information, please go to www.electrolube.com.au