Electro-Com is the official distribution partner for Texas Instruments’ TI-RFID in Australia and New Zealand.
Texas Instruments began ramping to volume production in the millions in July 2005, starting with its ultra-high frequency (UHF) EPC Gen 2 inlays. Label converter and printer manufacturer partners are working to incorporate TI's Gen 2 inlays and straps into finished labels for use by consumer goods manufacturers in the global retail supply chain.
Electro-Com was the first company to demonstrate production samples of UHF Gen 2 RFID inlay in Australia at the RFID World 2005 Exhibition, held in Sydney in August 2005.
TI and Electro-Com are working to facilitate interoperability of the EPC Gen 2 infrastructure, including encoders, readers, printers and hardware devices, and accelerating market adoption by consumer goods manufacturers and retailers.
In April 2005, TI announced broad support by 12 of the leading printer and reader companies who are committed to providing products based on the EPC Gen 2 standard and who are working in close collaboration with TI to bring to market a wide range of interoperable solutions.
This UHF Gen 2 production milestone introduces additional TI-RFID innovations to new markets. TI co-invented the flexible RFID inlay with the introduction of its Tag-it product line in 1998.
TI was the first company to work with leading label converter companies to build standardised smart label conversion processes for RFID technology.
The EPC Gen 2 standard is the newest and most advanced of the RFID specifications for the UHF band centred around 900MHz and is widely supported by end-users and manufacturers within the RFID industry.
Texas Instruments is working with the EPCglobal Inc standards organisation and is actively extending its efforts within the International Standards Organisation (ISO)/International Electrotechnical Commission (IEC) process to accelerate the process of ISO/IEC standardisation of EPC Gen 2 for global adoption.