Using an advanced silicon design that improves tag performance, and facilitates speed and visibility of retail supply chain goods, Texas Instruments Incorporated (TI) has made available its Electronic Product Code (EPC) Generation 2 (Gen 2) ultra high frequency (UHF) silicon.
Offered in wafer and strap form factors, TI has developed its Gen 2 silicon on the advanced analogue process node at 130 nanometre, and with built-in Schottky diode for more efficient conversion of Radio Frequency (RF) signal energy. The result is silicon chips with low power consumption and increased chip to reader sensitivity.
Companies deploying UHF-based RFID systems based on TI’s Gen 2 technology can potentially capture a greater percentage of reads on cases and pallets, as they move through manufacturing and distribution channels. With improved chip-to-reader sensitivity, companies can expect to more accurately track products and packages at all points throughout their supply chain operations and improve process flow. TI’s chip also delivers reliable read range performance across both standard and dense reader mode operations. As a result, users are less constrained in the set-up and placement of RFID readers, and can more readily achieve effective results and maximum read rates.
Offering greater design flexibility to customers, TI is providing its Gen 2 silicon to inlay, label and packaging manufacturers in three convenient forms: bare wafers to support various assembly processes; processed wafers (bumped, sawn with black grind) that are suitable for immediate use with commercially available inlay equipment; and silicon chip on straps for label and packaging manufacturers who are printing their own antennas. TI is also offering reference antenna designs, enabling customers to develop labels and tags, which optimise its Gen 2 silicon.
Users of EPC Gen 2 tags, from box and label manufacturers to distributors of consumer product goods, have different needs and expectations from RFID systems that power their supply chains. With TI technology, they can take advantage of the form factor that is suited for their manufacturing flow. TI’s Gen 2 chip is available in a variety of form factors that users will find convenient and flexible.
TI’s Gen 2 silicon is intended for use in the manufacture of passive RFID tag products operating in the 860 to 960 MHz, frequency band. Meeting all of the EPCglobal Gen 2 and ISO/IEC 18000-6c required specifications with 192 bits of memory, the chip also goes beyond the standard requirements to provide additional functionality by supporting block write and block erase commands.