Home > Siemens Wireless Modules to launch HC25 HSDPA module in Hong Kong

Siemens Wireless Modules to launch HC25 HSDPA module in Hong Kong

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article image HC25

The Siemens HC25 is a wireless module that utilises HSDPA technology to facilitate high data transmission speeds for mobile applications.

Siemens Wireless Modules will launch the new HC25 HSDPA module at the ITU Telecom World and 3G World Congresses, both of which will take place in Hong Kong from 4 - 8 December 2006.

The HC25 will mean a breakthrough for mobile devices and solutions such as Rugged PDAs, gateways, routers, security monitoring systems, remote computing and remote data acquisition systems.

Features of the new HC25 product include:

  • HSDPA with up to 3.6 Mbit/s download speed
  • Tri-band UMTS/HSDPA
  • RIL/NDIS driver for Windows-based devices
  • USB 2.0 full speed
  • Voice and data support
  • RoHS compliant

With quad band GSM/GPRS/EDGE 850/900/1800/1900 MHz, the HC25 is suitable for operation on all the new 3G networks in Australia.

Devices manufactured with the HC25 will be more flexible, with a wider coverage than any GSM/GPRS or CDMA device/application previously developed, as the new 3G networks are expected to cover the areas previously covered by GSM/GPRS and CDMA with a single network.

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