Home > F&K Delvotec Desktop Micro Factory wire bonders available from Crystalaid Manufacture

F&K Delvotec Desktop Micro Factory wire bonders available from Crystalaid Manufacture

Supplier News
article image Desktop Micro Factory wire bonder

Crystalaid Manufacture  have announced the acquisition of equipment, which provides manufacturing capabilities covering a range of die and wire bonding applications and testing. Die and Wire Bonding technologies interconnect an integrated circuit (IC) and printed circuit board (PCB) or ceramic substrate.

Crystalaid Manufacture’s F&K Delvotec Desktop Micro Factory is a fully automatic wire bonder which provides:

  • Gold ball bonding
  • Thin wire wedge-wedge bonding
  • Deep access bonding
  • Thick wire wedge bonding
  • Heavy ribbon bonding

The F&K Delvotec Desktop Micro Factory automatic wire bonder can test components using both pull and shear tests. The F&K Delvotec Desktop Micro Factory automatic wire bonder is based on a platform using different bond and test heads. The operators can change a bond head quickly to be ready for the next production step.

Crystalaid Manufacture utilise the Zevac IP-500 tabletop system which is a multi-function automatic die bonder. The machine resolution in the x-y axis is 1 µm and the process accuracy at 6s is < 10 µm.

The Zevac IP-500 tabletop system has the capability to provide a variety of functions, including absolute and relative die placement according to CAD data. The Zevac IP-500 tabletop system has the following functions:

  • Dispensing high viscosity material (silver epoxy) using volumetric screw dispenser Dispensing high viscosity material (silver epoxy) using Slide Fluxer (stamping adhesives)
  • Dispensing low viscosity material using pneumatic dispenser
  • Flip chip assembly including Flux Pool
  • Eutectic die attach
  • Chip on chip attachment

Newsletter sign-up

The latest products and news delivered to your inbox