Crystalaid Manufacture have announced the acquisition of equipment, which provides manufacturing capabilities covering a range of die and wire bonding applications and testing. Die and Wire Bonding technologies interconnect an integrated circuit (IC) and printed circuit board (PCB) or ceramic substrate.
Crystalaid Manufacture’s F&K Delvotec Desktop Micro Factory is a fully automatic wire bonder which provides:
- Gold ball bonding
- Thin wire wedge-wedge bonding
- Deep access bonding
- Thick wire wedge bonding
- Heavy ribbon bonding
The F&K Delvotec Desktop Micro Factory automatic wire bonder can test components using both pull and shear tests. The F&K Delvotec Desktop Micro Factory automatic wire bonder is based on a platform using different bond and test heads. The operators can change a bond head quickly to be ready for the next production step.
Crystalaid Manufacture utilise the Zevac IP-500 tabletop system which is a multi-function automatic die bonder. The machine resolution in the x-y axis is 1 µm and the process accuracy at 6s is < 10 µm.
The Zevac IP-500 tabletop system has the capability to provide a variety of functions, including absolute and relative die placement according to CAD data. The Zevac IP-500 tabletop system has the following functions:
- Dispensing high viscosity material (silver epoxy) using volumetric screw dispenser Dispensing high viscosity material (silver epoxy) using Slide Fluxer (stamping adhesives)
- Dispensing low viscosity material using pneumatic dispenser
- Flip chip assembly including Flux Pool
- Eutectic die attach
- Chip on chip attachment