Clarke & Severn Electronics supplies the Taconic RF-35A2 power amplifier substrate, which has been engineered with an ultra low fibreglass content to ensure high insertion loss properties and a homogeneous dielectric constant throughout the laminate.
Extremely low x and y coefficients of thermal expansion are achieved in the power amplifier substrate by a uniform dispersion of ceramic throughout the laminate.
These low x and y coefficients, along with the low modulus make RF-35A2 a strong choice of insulating substrates for surface mounting chip carriers.
Manufactured in a proprietary multi-step process, RF-35A2 power amplifier substrate delivers solid dielectric properties and significant copper peel adhesion.
A low 0.0011 dissipation factor at 1.9GHz allows for maximum power transfer, resulting in low heat generation.
The benefits of using RF-35A2 power amplifier substrate include:
- low loss properties
- Dk tolerance of +/-0.05
- homogeneous Dk
- excellent peel strength
- low moisture absorption; and
- ease of drilling.