Home > New Tflex XS400 Series Thermal Gap Fillers from Clarke & Severn Electronics

New Tflex XS400 Series Thermal Gap Fillers from Clarke & Severn Electronics

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Clarke & Severn Electronics  offers the Tflex XS400 Series thermal pads, the very latest in the Tflex thermal gap filler line for use in various industrial applications.

The Tflex XS400 Series thermal pads offer a compliant elastomer gap filler specifically designed to provide moderate thermal performance with a thermal conductivity of 2.0 W/mK.

The soft interface pad of the thermal gap fillers conforms to minimal pressure, resulting in minimal thermal resistance even at low pressure with little or no stress on mating parts.

Tflex XS400 Series thermal gap fillers are available in thicknesses from 0.50mm through to 5.0mm. The thermal material is easily assembled without any adhesive coating.

The TG (Tgard) liner on the other side of the thermal pads makes them electrically insulated. Offering stable operation from -40ºC to 160ºC temperature range, the thermal gap fillers are certified to UL 94V0 flammability rating and also meet RoHS compliance.

Jane Bell, Thermal Interface Materials Product Manager at Laird Technologies says that the Tflex XS400 gap filler is an easy-to-handle thermal pad that possesses low outgassing properties.

These characteristics make the Tflex XS400 Series ideal for telecom, IT, consumer, automotive, LED and power supply applications, which require a gap pad between heat generating components and heatsinks, facilitating electrical isolation with the ability to absorb high tolerance stack-up.

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