Clarke & Severn Electronics adds the Tflex SF600 DF to the Tflex thermal gap fillers line from Laird Technologies.
Tflex SF600 DF pads are compliant, silicone-free elastomer gap fillers specifically designed to provide moderate thermal performance with a thermal conductivity range of 2.8 W/mK - 3.0 W/mK.
Tflex thermal gap fillers are available in thicknesses ranging from 0.25mm to 1.5mm. The soft interface pads conform to minimal pressure, resulting in minimal thermal resistance even at low pressure with little or no stress on mating parts.
A differential tack on one side and dry to the touch on the other, Tflex silicone-free thermal gap fillers offer easy assembly.
Tflex SF600 DF passes ‘cleanliness’ testing requirements and is rated for International Disk Drive Equipment and Manufacturing Association (IDEMA) M11-99, M7-98, M12-99 and M13-99 standards. The gap filler pads are RoHS compliant and certified to UL 94V0 flammability rating.
Jane Bell, Laird Technologies Thermal Interface Materials Product Manager says that the Tflex SF600 DF thermal gap fillers are high performance, silicone-free thermal pads specifically designed for silicone-sensitive applications such as fibre optics, automotive modules, plasma display panels and hard disk drives (HDDs).