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Thin film, single-value chip and wire capacitors

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article image Smaller size --- better preformance.

VISHAY Intertechnology, represented by Braemac , has announced the release of the NC Series of thin film, single-value chip and wire capacitors.

With sizes ranging from 0.020” x 0.020” to 0.060” x 0.060” and capacitance values from 0.5pF to 1000pF, the new capacitors from Vishay Electro-Films offer smaller size, better performance, and stability when compared to thick film competitors.

Designed for assembly in hybrid circuits using conventional wire-bonding techniques - one epoxy attach and one wire bond - the five capacitor models provide a high degree of layout flexibility in RFI and EMI filters, bypass capacitors, CMOS digital filters, and low-pass filters in smart cards, passive electronic ID tags, and other hybrid products.

The new NCA, NCB, NCC, NCD, and NCE devices are available with a combination silicon dioxide/silicon nitride dielectric (MNOS) or, for critical microwave or high-frequency applications in which low dielectric absorption is required, with a silicon dioxide dielectric (MOS).

NCA capacitors measure 0.020” x 0.020” and offer a capacitance range of 0.5pF to 51pF. NCB capacitors measure 0.030” x 0.030” with a capacitance range of 33pF to 100pF. NCC devices measure 0.040” x 0.040” with a range of 56pF to 220pF.

NCD devices measure 0.055” x 0.055” with capacitance values from 150pF to 510pF, and NCE capacitors measure 0.060” x 0.060” with a range of 360pF to 1000pF. Tolerances down to ±2.5% are available for the series.

NCA, NCB, and NCC capacitors each feature a single top contact, while the larger NCD and NCE versions provide three parallel, connected top contacts for bonding convenience.

All five capacitor models feature a semiconductor silicon substrate, an aluminum bond pad measuring at least 0.005” x 0.005”, and a gold backing.

Manufactured with Vishay Electro-Films' (EFI) sophisticated thin film equipment and manufacturing technology, NC Series capacitors have a standard thickness of 0.010” [0.25 mm].

The devices' compact dimensions and stable performance reduce signal drift, while their versatile pad layout allows for design of smaller end products.

Compatibility with standard IC assembly methods help ensure low-cost assembly. The new capacitors are 100% electrically tested and visually inspected to MIL-STD-883.

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