STMicroelectronics, represented by Braemac , has introduced one of the smallest packages available on the market, the MLP8 2x3.
Also called UFDFPN8, by JEDEC codification, the 8-pin MLP8 2x3 is even smaller than the TSSOP8 3x3 (5x3 footprint) by approximately 60%.
This 8-lead UFDFPN8 (Ultra-thin, Fine-pitch, Dual-Flat-Package No-lead) package has a body width of 2mm and a length of 3mm.
Its 0.6mm height represents a real advantage for designers and makes it an ideal choice for applications seriously constrained by space, especially portable device applications.
The MLP8 is now available for ST's M34C02 I2C EEPROM, which is dedicated to DRAM modules, and the M24C16 16kb standard EEPROM. It will also be available for the soon-to-be-introduced M93C66 4kb MICROWIRE bus-based Serial EEPROM and the M95160 16kb SPI-based Serial EEPROM.
All densities of ST Serial EEPROMs, from 1kb to 16kb, will eventually be made available in this package. The M34E02, for DDRII, DRAM modules, will also be offered in this package.
ST's new MLP-packaged devices allow entry into tightly spaced applications that were previously not attainable.
The MLP8 2x3 uses ST's ECOPACK lead-free technology for RoHS-compliance (the EU directive on restriction on use of hazardous substances).
Delivered in standard Tape-and-Reel, this tiny, robust package is easy to handle in automated production lines, and with a 0.5mm lead pitch, the package is also easy to mount.