STMicroelectronics (ST - distributed by Braemac ) is the latest semiconductor vendor to join the Open Core Protocol International Partnership (OCP-IP), the association providing a common standard for intellectual property core interfaces, or sockets, that facilitate “plug and play” system-on-chip (SoC) design.
The company has joined as a Governing Steering Committee (GSC) member, and will also participate in OCP-IP’s working groups. As a member of the GSC, ST joins a team drawn from GSC members including Nokia, Texas Instruments, Sonics Inc and United Microelectronics Corporation (UMC). Working groups are charged with the developing enhancements and support for OCP. The group recently announced the availability of the OCP 2.0 Specification Release Candidate.
“Standardisation of a socket interface and its broad adoption in the semiconductor industry are key factors to enable development of reusable IP [intellectual property] and IP integration in complex SoC products,” says Aldo Cometti, director of development at ST and OCP-IP GSC member. “We count on this to further evolve our system level designs and to reduce complex SoC product design cycles and time-to-market.”
OCP-IP members, in particular, receive free training and support, free software tools and free documentation, easing the challenges of SoC design.
“We welcome ST to the GSC. They clearly understand the need for an industry socket standard for intellectual property cores that are not limited to application specific usage,” says Ian Mackintosh, president of OCP-IP.