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Compact, high power diode package

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article image SMF package diode products.

VISHAY Intertechnology, represented by Braemac , has announced the availability of more than 120 diode devices in the SMF (DO219-AB) package, which combines high power capability and compact dimensions to save space on printed circuit boards.

The diode products offered in the SMF address all industry segments and include switching, fast switching, ultrafast switching, Schottky, ESD protection, and Zener diodes.

The SMF (DO219-AB) package’s dimensions are 3.7 x 1.8 x 0.98mm making it suitable for small and light portable products, such as cellular phones, notebook PCs, and portable consumer products, as well as space-constrained automotive modules. The small space requirement provides good circuit board density.

By maximising power dissipation per unit of board space used, the package is also suitable for portable and wireless board designs that must meet strict power-management and protection requirements.

The SMF-packaged devices can be used as drop-in replacements for the diodes in the SOD-123FL, SOD-87, and PowerMite. The SMF offers better power handling and a height profile that is as much as 50% lower than other units.

The SMF (DO219-AB) package can also be used to replace larger-footprint devices such as the SMA and M1F with space savings up to 40%.

High power capability and low forward voltage are delivered by Vishay's folded lead frame technology, which ensures power efficiency and good surge-current capability compared to wire bond packages for excellent effectiveness in protection applications.

Vishay's low-leakage-current silicon technology has been designed into the new packaging to improve energy savings.

The SMF (DO219-AB) delivers good performance in an environmentally friendly, lead (Pb)-free package platform. It is 260 °C reflow capable to moisture sensitivity level (MSL) 1, and it is backward compatible with existing reflow processes.

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