Bestech Australia presents BCM’s range of pressure and acceleration sensor dies. These silicon chip dies are small in size and each have their own functions and applications. These silicon chip dies are only 1mm in diameter, and feature pressure ranges of 0-1 bar to 0-35 bar (absolute). The SE101 silicon chip dies are used for absolute pressure measurement and manufactured in a silicon-silicon structure through MEMS technology. Low cost applications of the silicon chip dies include tyre pressure monitoring and engine control, use in consumer electronics or use as an industrial pressure sensor.
These pressure sensor dies are constructed from high quality silicon wafer on glass through a 4” MEMS process, and can be in gauge or absolute pressure form, with pressure ranges varying on the silicon chip dies from 0-200 mbarG up to 0-1000 barA. These multifunctional pressure sensor dies consist of two independent Wheatstone bridge circuits which measure static pressure. along with differential pressure in an industrial process. The silicon chip dies are constructed similar to the SE103. Differential pressure ranges of 0-400 mbar to 0-10 bar are available, with static pressure up to 160 bar. These silicon chip dies are used typically for air and mass flow measurements in industrial processes.
Due to the MEMS technology used in these pressure sensor chips, the pressure membranes of these sensors possess high sensitivity and high overload pressure capability. The accuracies of these chips are optimum, between 0.25% and 0.5% FS.Also available from Bestech Australia are the SE107 single axis accelerometer dies. These dies use a differential capacitive working principle and have a silicon on glass structure. They are made from high quality silicon wafers using MEMS processes. The use of capacitive technology results in
low stress effects and the effect of temperature is minimised. These accelerometer chips can measure up to ±2g.