New PrimePACK modules of Infineon Technologies AG in the 1200V and 1700V voltage classes are up to 45 % lighter when compared to modules with the same power.
Infineon is the sole semiconductor company that has achieved production status today for such compact and high-performing IGBT (Insulated Gate Bipolar Transistor) modules.
Infineon Technologies introduced this family of compact IGBT modules that enable power converter system solutions optimised for various industrial drives, windmills, elevators, traction or auxiliary drives, power supplies and heating systems in trains and tractors at the PCIM 2007 Exhibition and Congress in Nuremberg.
The PrimePACK modules available from Avnet are based on an innovative packaging concept that also utilises the advantages of the Infineon IGBT4 chips, which features good electrical ruggedness.
The unique module design offers many advantages, such as the special layout of the IGBT chips inside the module that significantly improves heat distribution.
The IGBT chips are closer to the baseplate’s screw-fastening points, resulting in a low thermal resistance between the baseplate and heatsink. Internal stray inductance is reduced by approximately 60 percent from that of comparable modules.
The half-bridge configuration and modular design of the PrimePACK modules make it easy to scale the converter power by employing different module sizes or by connecting the modules of a given type in parallel.
PrimePACK modules are available in both 1200V and 1700V voltage classes and in two module sizes - the 89mm x 172mm PrimePACK 2 and the 89mm x 250mm PrimePACK 3.
These modules are up to 45 % lighter than comparable modules with the same power. Lighter modules make it easier to construct and install power converters.