Submissions are now open for the sixth annual scholarship program offered by the Australian Packaging and Processing Machinery Association (APPMA), in conjunction with the Australian Institute of Packaging (AIP).
The annual scholarship, worth over $9000 will enable a packaging engineer to complete a Diploma in Packaging Technology.
The Diploma in Packaging Technology is an internationally recognised Level 5 foundation Degree qualification that will prepare students to take responsibility for packaging operations at any level through the supply chain. The program provides an opportunity to study the principles of packaging, packaging materials and packaging processes.
According to Mark Dingley, Chairman of the APPMA, the Annual Scholarship Program is a unique opportunity for a packaging engineer to attain a Diploma in Packaging Technology and further their education in the packaging industry. Jamie Schellebeck MAIP, who was the 2013 scholarship winner, is a Packaging Engineer at Amcor Fibre Packaging. Mr Schelleback explains winning the scholarship in 2013 was a wonderful opportunity for him to gain more technical expertise in the packaging industry by undertaking the Diploma in Packaging Technology.
Mr Ralph Moyle, MAIP, National President of the AIP, added that the AIP is at the forefront of packaging training and education in Australasia, helping to shape the careers of generations of packaging professionals from packaging technologists to international packaging business leaders along with a host of people in associated disciplines such as sales and marketing, purchasing, production and environment.
Submissions must be received by Close of Business on Friday the 11th of April with the 2014 winner being announced as part of the Packaging & Processing Week, which will be held alongside the AIP National Conference on Tuesday the 17th and Wednesday the 18th of June at the Sofitel Sydney.