Joint winners have been announced for the Australian Institute of Packaging Scholarship for the first time in five years.
Awarded every year to one of the finalists in the 2013 Cormack Innovation Awards, the AIP scholarship was awarded this year to two outstanding students from the University of Technology Sydney - James Bossi and Justin Chong.
According to Mr Ralph Moyle, National President of the AIP, both candidates were excellent examples of the quality of students undertaking design courses in Australia.
According to Mr Moyle, James Bossi demonstrated good methodology and thinking throughout the scholarship process. He displayed a clear interest and involvement in the packaging industry, understood the importance of recycling and sustainability within packaging design development and took real interest in solving some of the packaging problems experienced by the industry.
On Justin Chong, Mr Moyle said he was already doing Point of Sale construction and design and his mechanical skills were part of his in-depth answers. He provided compelling answers to all questions and was well-spoken and articulate.
Mr Moyle added the judges hoped that other schools throughout Australia would allow their students to participate and take advantage of opportunities like the Cormack Innovation Awards. The AIP would like to take this opportunity to congratulate James Bossi and Justin Chong for being such exceptional candidates and the Institute looks forward to seeing both of these students become outstanding packaging technologists.
The Cormack Innovation Award scholarship complements other programs initiated by the AIP including the APPMA scholarship for the Diploma in Packaging Technology and the AIP scholarship for the PCA Southern Cross Awards.