The Australian Institute of Packaging has announced that program and registration forms for their biennial National Technical Forum are now available. The forum will be held alongside AUSPACK PLUS, on the 23rd and 24th of March 2011 at the Melbourne Convention & Exhibition Centre.
The Australian Institute of Packaging National Technical Forum is designed to bring together packaging technologists and other members of the Institute from around the country for two days to gain further insight into the advancements and technologies currently available to them in the world of packaging.
As with all Australian Institute of Packaging events, the forums will provide an opportunity for professional development and learning for members so that they have the knowledge to lead the way in packaging technology.
Established by the Australian Institute of Packaging in 2005, in strong collaboration with both the Australian Packaging and Processing Machinery Association (APPMA) and AUSPACK PLUS organisers Exhibition Trade Fairs, the National Technical Forums have booked out each year; a consistently strong attendance record that speak volumes about the quality and relevance of the event.
This years theme of the Australian Institute of Packaging National Technical Forum will be ‘The Packaging Supply Chain’, and with over 35 speakers presenting over two days, the forum is expected to be a must-attend event on the 2011 calendar.
Bringing together people from all areas within the packaging industry and from food, beverage and manufacturing companies, the Australian Institute of Packaging National Technical Forum is designed to provide education and training for the packaging industry.
The National Technical Forum is supported by:
- Australian Packaging and Processing Machinery Association (APPMA)
- Exhibition & Trade Fairs (ETF)
- Viscount Plastics
- Labourforce International
- Wellman Packaging and Cormack Packaging.