The Australian Packaging and Processing Machinery Association (APPMA) together with the Australian Institute of Packaging (AIP) are pleased to announce that submissions are open for the third annual scholarship program for 2011.
The APPMA 2011 annual scholarship program will enable a packaging engineer to complete a Diploma in Packaging Technology.
2010 winner Natalie Quarrell, Packaging and Product Development Officer, Bega Cheese, Strathmerton, Victoria says the scholarship enables her to gain the knowledge, skills, experience and confidence that will be of benefit throughout her entire packaging career.
The APPMA is a national-level organisation representing the packaging and processing machinery industry in Australia.
The scholarship program aims to identify a packaging engineer seeking to further their education, and provides a scholarship for a program in Packaging Technology.
Mr Rob Lawrence, Chairman of the Australian Packaging and Processing Machinery Association says that the annual scholarship enables the awardee to enrol at the Australian Institute of Packaging Diploma in Packaging Technology program.
The Diploma in Packaging Technology is an internationally recognised qualification for those wishing to pursue a career in the packaging industry, or for those already in the industry and wishing to extend their knowledge and expertise.
Pierre Pienaar, FAIP, National President of the AIP adds that the Institute is grateful that associations such as the APPMA recognise the importance of education and training, and are contributing to the growth of the packaging industry as a whole in Australia.
Entries are now available for the APPMA 2011 Scholarship Program on the APPMA or AIP websites.
Submissions must be received by close of business on Friday the 18th of February and the 2011 winner will be announced at AUSPACK PLUS to be held between 22nd and 25th of March at the Melbourne Exhibition & Convention Centre, Victoria.