NATIONAL Semiconductor, represented in Australia by Arrow Electronics , has released integrated circuit (IC) packages as thin as four sheets of office paper.
The micro surface-mount devices (SMDs) and leadless leadframe packages (LLPs) enable manufacturers to build smaller, thinner and lighter mobile phones, displays, MP3 players, and PDAs. The 0.4mm packages are available with traditional tin-lead or lead-free interconnect options.
They may be used by OEMs with conventional surface-mount handling equipment. The SMDs are available in four-bump to 36-bump packages. The LLPs are available in six-lead to 80-lead package types. They offer improved electrical, thermal and moisture sensitivity, as well as reduced noise and easier board assembly.