FAIRCHILD Semiconductor, represented by Arrow Electronics , has introduced MicroPak 8, a new eight-terminal chip scale leadless package for 1, 2 and 3-bit logic and switch functions.
The new TinyLogic MicroPak 8 package offers 60% space savings over leaded US8 packages while maintaining 0.5mm terminal pitch.
This allows designers to take advantage of the dramatic size reduction to incorporate product improvements or to implement new designs while utilising existing component mounting processes.
Fairchild MicroPak 8 devices are suitable for use in PDAs, cell phones, digital cameras, notebooks and other ultra portable applications.
The large, 0.2 x 0.3mm land grid array (LGA) contact pads assure strong joint integrity essential for reliable operation under harsh environmental stresses such as excessive keyboard pressure and over-temperature conditions.
Offered now in MicroPak 8 is the UHS high-performance low-voltage logic family that includes triple buffers, dual 3-state buffers, dual gates, flip flops, dual analogue and bus switches.
Later this year, new high-performance 1, 2 and 3-bit ultra low power (ULP) and ULP-A logic functions, designed for 0.9 to 3.3V operation, will be offered in MicroPak 8.